星空体育频道: 2013-07-07

2013年7月13日星期六

LED Lighting Power Integrations goes for LED GU10s

2013/06/18

26jun13PowerIntRef 693 Power Integrations is aiming for the most price-competitive end of the LED lighting with a chip for incandescent light bulb replacement, including the challenging GU10.

Called LYTSwitch-0, the family implements a single-stage non-dimmable non-isolated topology for loads up to 10W.

“Two stage is unsustainable in terms of cost,” marketing manager Peter Robertson told Electronics Weekly. “A LYTSwitch-0 design has about 13 components: the BOM is cheap.”

This is for a high-side switched buck converter. With more components, other modes can be implemented including: low-side buck, buck-boost, fly-back and boost.

With a 700V main switch on-board, operation from ac inputs of 85 to 308V can be sustained.

26jun13PowerInt 685 To go with the chip family, the firm has released a 6W GU10 bulb reference design (RDR-355) with 110mA output into a 54V (nominal) LEDs string – a ceramic tile-style multi-die array, for example.

A 6W GU10 reference design, with Power Integrations’ annotations

Key parameters for the universal input design are: 0.82 power factor and 92.1% efficiency at 120V, and 0.52 power factor and 91.3% at 240V. “This meets EC Eco Design Directive [Lot 19 Part 2] with a power factor over 0.5 and Energy Star [Version1, Draft 4] with a power factor above 0.7,” said the firm. Output regulation is +/-5%.

The efficiency figures are aided by the high output voltage and could be expected to fall if a 3V output design was attempted.

Claimed temperature rise with the specified components and layout supplied from 90V is 27°C.

There is no bias winding in the design. Instead the chip takes power from the drain connection when the main switch is ‘off’, storing supply energy in the bypass capacitor for the rest of the cycle.

Operational frequency is around 66kHz, dithered to ease EMC control.

Excess temperature is an issue with all LED light bulbs as designers have no control over where consumers install them. Overheating leads to short life, particularly if necessary electrolytics get over-hot.

While some chip makers are choosing to reduce current as temperature increases, dimming the LED, before cutting current completely if the situation does not improve, Power Integrations has chosen to operate at constant output up to a threshold temperature, then cut power completely.

Four products: LYT0002, 0004, 0005 and 006, span output currents from 30mA to 280mA over various input voltage ranges and two modes: ‘mostly discontinuous conduction’ (MDCM) and continuous conduction’ (CCM).

“In general, MDCM provides the lowest cost and highest efficiency converter. CCM designs require a larger inductor and ultrafast [~35ns recovery] free-wheeling diode in all cases. It is lower cost to use a larger LYTSwitch-0 in MDCM than a smaller LinkSwitch-0 in CCM because of the additional external component costs of a CCM design. However, if the highest output current is required, CCM should be employed,” said the firm.

Except for the 0002, the family includes automatic re-start circuits for fault conditions.

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Disks don't need planets to make patterns, NASA study shows

But a new study by NASA scientists sounds a cautionary note in interpreting rings and spiral arms as signposts for new planets. Thanks to interactions between gas and dust, a debris disk may, under the right conditions, produce narrow rings on its own, no planets needed.

Watch the changing dust density and the growth of structure in this simulated debris disk, which extends about 100 times farther from its star than Earth's orbit around the sun. At left, the disk is seen from a 24-degree angle; at right, it's face-on. Lighter colors show higher dust density.

"When the mass of gas is roughly equal to the mass of dust, the two interact in a way that leads to clumping in the dust and the formation of patterns," said lead researcher Wladimir Lyra, a Sagan Fellow at NASA's Jet Propulsion Laboratory in Pasadena, Calif. "In essence, the gas shepherds the dust into the kinds of structures we would expect to be see if a planet were present."

A paper describing the findings was published in the July 11 issue of Nature.

The warm dust in debris disks is easy to detect at infrared wavelengths, but estimating the gas content of disks is a much greater challenge. As a result, theoretical studies tend to focus on the role of dust and ice particles, paying relatively little attention to the gas component. Yet icy grains evaporate and collisions produce both gas and dust, so at some level all debris disks must contain some amount of gas.

"All we need to produce narrow rings and other structures in our models of debris disks is a bit of gas, too little for us to detect today in most actual systems," said co-author Marc Kuchner, an astrophysicist at NASA's Goddard Space Flight Center in Greenbelt, Md.

Here's how it works. When high-energy ultraviolet light from the central star strikes a clump of dust and ice grains, it drives electrons off the particles. These high-speed electrons then collide with and heat nearby gas.

The rising gas pressure changes the drag force on the orbiting dust, causing the clump to grow and better heat the gas. This interaction, which the astronomers refer to as the photoelectric instability, continues to cascade. Clumps grow into arcs, rings, and oval features in tens of thousands of years, a relatively short time compared to other forces at work in a young solar system.

A model developed by Lyra and Kuchner shows the process at work.

"We were fascinated to watch this structure form in the simulations," Lyra said. "Some of the rings begin to oscillate, and at any moment they have the offset appearance of dust rings we see around many stars, such as Fomalhaut."

In addition, dense clumps with many times the dust density elsewhere in the disk also form during the simulation. When a clump in a ring grows too dense, the ring breaks into arcs and the arcs gradually shrink until only a single compact clump remains. In actual debris disks, some of these dense clumps could reflect enough light to be directly observable.

"We would detect these clumps as bright moving sources of light, which is just what we're looking for when we search for planets," adds Kuchner.

The researchers conclude that the photoelectric instability provides a simple and plausible explanation for many of the features found in debris disks, making the job of planet-hunting astronomers just a little bit harder.

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Raising adopted children: How parents cooperate matters more than gay or straight

July 13, 2013 — A study suggests that whether parents are gay, lesbian or straight, how well they work together as a couple is linked to fewer behavior problems in their adopted children and is more important than their sexual orientation.

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A new study by psychology researchers suggests that whether parents are gay, lesbian or straight, how well they work together as a couple and support each other in parenting is linked to fewer behavior problems among their adopted children and is more important than their sexual orientation.

Rachel H. Farr at the University of Massachusetts Amherst and Charlotte J. Patterson at the University of Virginia report their findings from this first empirical examination of differences and similarities in co-parenting among lesbian, gay and heterosexual adoptive couples and associations with child behavior in the July/August issue of Child Development.

Farr, who led the study, says, "While actual divisions of childcare tasks such as feeding, dressing and taking time to play with kids were unrelated to children's adjustment, it was the parents who were most satisfied with their arrangements with each other who had children with fewer behavior problems, such as acting out or showing aggressive behavior."

"It appears that while children are not affected by how parents divide childcare tasks, it definitely does matter how harmonious the parents' relationships are with each other," she adds. She and Patterson also observed differences in division of labor in lesbian and gay couples compared to heterosexual parents.

The study suggests that lesbian and gay couples may be creating new ways to live together and raise children outside of traditional gender roles, the authors say, and results are important to adoption professionals and others who work with adoptive families. Further, the research is informative for those debating legal, political and policy questions about family dynamics and outcomes for children raised by same-sex couples.

For this study, Farr and Patterson recruited families from five adoption agencies across the United States. In total, 104 families agreed to participate, 25 headed by lesbian partners, 29 by gay male partners and 50 by heterosexual couples. Their adoptive children had been placed with them at birth or within the first few weeks of life; at the time of the study the children were all around three years old.

Parents were asked to report on the division of child-related labor between them and on factors of their child's adjustment. They were also observed by researchers who coded their co-parenting behavior during videotaped parent-child play sessions along scales rated for "supportive" and "undermining" interactions, using an established test.

The researchers discovered that lesbian and gay couples were more likely to equally share childcare tasks, while heterosexual couples were likely to specialize, with mothers doing more work than fathers in these families. In addition, Farr says, from the videotaped observations of family interactions, "it was clear that other aspects of co-parenting, such as how supportive parents were of each other, or how much they competed, were connected with children's behavioral problems."

Parents' dissatisfaction with division of child-care labor, not the actual division of these tasks, was significantly associated with increased child behavior problems. As the researchers had expected, supportive co-parenting interactions, such as greater pleasure and engagement between parents, were associated with positive child behavior for all three types of parents.

Overall, whether parents shared child care tasks or had a more specialized division of this work was not related to children's adjustment. The best predictor of child behavior problems was competition between the parents and dissatisfaction with child care labor divisions, which were not related to parents' sexual orientation.

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Communications White space radio standard demonstrated at Cambridge event

2013/07/02

Moller CEntre A white space radio link based on the Weightless air-interface standard connecting wireless sensors has been demonstrated in an application simulating wireless sensors in road, building and bridge infrastructure.

The demonstration by the Weightless SIG was shown at the 5th Future of Wireless International Conference by Weightless SIG Core Member, Argon Design.

In the demonstration, a model bridge equipped with strain gauges sensing displacement in the bridge structure is connected to an early evolution Weightless terminal device measuring 115mm x 60mm x 30mm built into the bridge structure.

This communicates over a Weightless air interface to a base station that could be sited several kilometres from the bridge. In this demonstration a user application processes the data to determine when the parameters measured by the sensors integrated into the bridge structure fall outside of expected values to warn of potential structural problems such as metal fatigue and degradation.

White space communications involves using frequencies that are already allocated to licensed users, but are not being used for that application in the particular geographical location of the white space system, at that particular moment.

As such, they either need to ‘sniff’ the local radio environment, or consult a live maintained geographical database, and vacate immediately if a licensed user needs the frequency.

“Devices may need to rapidly vacate a channel if it is needed by a licensed user,” said the Weightless Special Interest Group (SIG). “They must consult a database to be informed as to the channels they can use and must quickly move off these channels as required.”

According to the SIG: “The FCC has specified 4W effective isotropic radiated power (EIRP) for base stations and 100mW EIRP for terminals. White space devices must not interfere with existing users of the spectrum, predominantly TVs. Hence, the energy that they transmit must remain almost entirely within the channels they are allowed to use. The FCC has specified that adjacent channel emission need to be 55dB lower than in-band emission, a specification much tighter than most of today’s wireless technologies.”

A video showing the demonstration.

“This public demonstration marks a watershed moment for Weightless technology,” said Alan Scott, CEO of Argon Design.

Commenting on the demonstration, Professor William Webb, CEO of the Weightless SIG said “This is a great proof point of the progress that the technology has made recently following the announcement of working silicon and completion of the Specification to version 1.0 earlier this year”. With over 950 worldwide Members already, the Weightless SIG continues to grow strongly and we expect to progressively see more applications developed over the course of the next few months”.

The 5th Future of Wireless International Conference took place on 1st & 2nd of July at The Møller Centre in Cambridge, UK.

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Communications XMOS: Home audio over Ethernet and wireless

2013/06/13

19jun13XMOS 594 XMOS has announced a reference design for Ethernet audio visual bridging (AVB) on its xCORE microcontrollers that allows daisy-chaining of audio products.

Ethernet AVB allows audio and video signals to be streamed with controlled latency over standard Ethernet and 802.11 wireless networks.

Ethernet AVB daisy-chain (AVB-DC) removes the need for a central Ethernet AVB switch, and is intended for products such as microphones and speakers.

“Daisy-chain capability allows installers to employ a much simpler network topology, reducing the cabling and installation costs for an AVB network, and it allows the creation of plug-and-play products,” claimed the firm. “It promises a revolution in the audio industry, opening up applications that previously were not viable. End-users will be able to connect together computers, audio devices and audio processing equipment, forming an Ethernet AVB network as they go. Consumer laptops such as the Apple MacBook and MacBook Air already support Ethernet AVB.”

The firm’s XS1-L16 16-core microcontroller is at the heat of the design, and can integrate two separate Ethernet AVB interfaces plus an AVB switch fabric.

It needs no external DRAM or operating system, and supports: up to four streams at 48kHz or two streams at 96kHz sample rate.

To back it up, there will be a hardware development kit in the autumn, and the firm has other Ethernet AVB reference designs.

The reference design is on show at Infocomm13 in Orlando this week.

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Communications Consortium tackles 4G LTE MIMO in airports

2013/07/05

Can a Cambridge company bring 4G MIMO to distributed antenna systems (DAS)?

DAS is a family of techniques that stretches the coverage of a single basestation throughout a large complex building, like a stadium or airport. It can be thought of as a low-cost alternative to multiple femtocells.

MIMO (multiple-in multiple-out) is an extension to 4G LTE, and other advanced mobile phone standards, that increases data bandwidth by using several antennas in the phone and several antennas at the basestation, combining signals from the resulting multiple wireless links.

In its simplest form, a DAS is a system of passive splitters, taps and coax cable connecting a conventional base station to many, perhaps hundreds, of small antennas dotted around the building – one per room for example.

A crucial feature of a DAS is that it should be ‘transparent’ – conveying signals to an un-modified basestation as though the basestation it was connected to a standard phone mast.

MIMO requires a minimum of two antennas to replace each single antenna, and for signals from both to be separately conveyed to the basestation.

With a simple DAS, this would mean doubling every component and cable.

“The brute force method to do MIMO is to use two signal paths, doubling the cost, but MIMO only adds 70% performance. It is no good getting 70% increase in performance for 100% increase in cost,” said Andy Bell, CTO of Zinwave, the Cambridge company concerned.

Zinwave offers a more complex, active, form of DAS.

“With coax, there is lots of loss and you only get 40W from the basestation. Most coax DAS run out covering 50,000ft2. Anymore and they need another basestation,” said Bell.

Coax systems can cover more area if amplifiers are included.

Amplifiers are naturally narrow band, argues Bell: for example, you need a UMTS amplifier with every GSM amplifier.

Instead, Zinwave has a wideband system – amplifying the entire 150MHz to 2.7GHz spectrum.

“I don’t believe, in the wireless world, there is a wideband system as wide as ours. To my knowledge, only the ECCM [electronic counter-countermeasures] system of the US Navy is wider,” said Bell.

Rather than coax, Zinwave uses optical fibre to transmit data. Its unique intellectual property is a way of modulating lasers that covers the bandwidth. Feedback around the link is used to maintain linearity and dynamic range in the signal path.

As part of an EU-funded project that has just started, along with several laser companies, Zinwave will develop a MIMO DAS using a single fibre to each antenna outpost to carry both signals from the MIMO antenna pair.

“The answer may be wavelength division multiplexing, there are several possibilities. It is unlikely to be time division multiplexing because that would mean modifying the signals,” said Bell.

The consortium plans to deliver a solution in 2015.

It’s commercial members are: Eblana Photonics (laser designers, Dublin), Innolume (laser makers, Dortmund), Constelex (photonic amplifiers, Greece) and Zinwave . Academic partners include the Centre for Advanced Photonics and Electronics (University of Cambridge), and the Tyndall Institute (University College Cork).

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Power Supplies 600W bench PSUs

2013/06/19

26jun13TdkLambdaZplus600 400 TDK has added 600W models to its Z+ bench-top PSUs.

“Complementing the Z+200, Z+400 and Z+800 ranges, these 600W supplies offer the same features and carry a 5-year warranty,” said the firm. The Z+600 range is also suited for ATE and OEM 2U rack mounted or integrated applications.

Models are available with outputs up to 100Vdc and 60A.

Units can operate in constant current or constant voltage modes, and accept a universal (85-265Vac) input.

Up to six identical units can be paralleled with active current sharing, and to increase the output voltage or to provide a bipolar output up to two units may be connected in series.

All models can be programmed via the front panel or remotely using USB, RS232/485 and analogue interfaces, which are built in as standard.

Optional LAN, GPIB (IEEE488) and isolated analogue programming interfaces are available.

CE marked for EMC and in accordance with the LV Directive and RoHS Directive, the Z+600 conforms to EN55022-B, FCC part-15-B and VCCI-B for conducted and radiated EMI. Safety approvals include UL/EN/IEC61010-1, and the Z+600 is designed to meet UL/EN60950-1.

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Business Semi equipment spending to fall 5.5% this year

2013/06/21

Gartner semi spending Worldwide semiconductor manufacturing equipment spending is projected to total $35.8 billion in 2013, a 5.5 percent decline from 2012 spending of $37.8 billion, according to Gartner. Gartner said that capital spending will decrease 3.5 percent in 2013, as major producers remain cautious in the face of market weakness.

“Weak semiconductor market conditions, which continued into the first quarter of 2013, generated downward pressure on new equipment purchases,” said Bob Johnson, research vice president at Gartner. “However, semiconductor equipment quarterly revenues are beginning to improve and positive movement in the book-to-bill ratio indicates that spending for equipment will pick up later in the year. Looking beyond 2013, we expect that the current economic malaise will have worked its way through the industry and spending will follow a generally increasing pattern in all sectors throughout the rest of the forecast period.”

Gartner predicts that 2014 semiconductor capital spending will increase 14.2 percent, followed by 10.1 percent growth in 2015. The next cyclical decline will be a mild drop of 3.5 percent in 2016, followed by a return to growth in 2017.

Although capital spending for all products will decline in 2013, logic spending will be the strongest segment, declining only 2 percent compared with a 3.5 percent decline for the total market. This is driven by aggressive investment of the few top players, which are ramping up production at the sub-30nm nodes.

Memory will continue to be weak through 2013, with maintenance-level investments for DRAM and a slightly down NAND market until supply and demand balance returns. For 2014, Gartner sees capital expenditure (capex) returning to growth with an increase of 14.2 percent over 2013.

The foundry segment will see an increase in spending of about 14.3 percent this year, while both integrated device manufacturers (IDMs), and semiconductor assembly and test services (SATS) providers will show spending declines.

Beyond 2013, memory surges in 2014 and 2015 and a cyclical decline in 2016, while logic returns to a steady growth pattern.

The wafer fab equipment (WFE) market is seeing continuous quarter-over-quarter growth in 2013, as major manufacturers come out of a period of high inventories and a generally weak semiconductor market.

Early in the year the book-to-bill ratio passed 1:1 for the first time in months, signaling that the need for new equipment is strengthening as demand for leading-edge devices is improving.

Looking beyond 2013, Gartner sees growth returning to the WFE market with double-digit growth in 2014 and 2015, before a modest cyclical downturn in 2016.

The capital spending forecast estimates total capital spending from all forms of semiconductor manufacturers, including foundries and back-end assembly and test services companies. This is based on the industry’s requirements for new and upgraded facilities to meet the forecast demand for semiconductor production. Capital spending represents the total amount spent by the industry for equipment and new facilities.

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Manufacturing Decline of DRAM production

2013/06/20

IHS DRAM Wafer DRAM wafer output, which peaked in 2008 at 16.4 million 300-millimeter-equivalent wafers, is expected to decline by 24% to 13 million this year, says IHS.

The projected cut will be the second straight year of deliberate downsizing following an 8% drop-off last year. This year’s output is expected to be slashed by 5% compared to 2012.

Curtailing DRAM capacity is a positive move for the industry, resulting in a gradual normalization between supply and demand for DRAM. The industry is now believed to be perhaps slightly undersized relative to demand because of the intentional slash in output, and DRAM pricing can continue to remain firm if production remains slightly behind demand.

DRAM revenue in the first quarter rose to its highest level in nearly two years, thanks to a jump in commodity prices spurred by demand from the server PC and mobile PC segments. Pricing for the 4GB DDR3 module rose to $23 in March, up from $16 in December, an unusually large increase.

Nearly 65% of all DRAM bit shipments went to a desktop or laptop 10 years ago, but that figure is less than 50% today and will fall further to south of 40% by the end of next year.

Meanwhile, servers and mobile gadgets like smartphones and tablets command an increasing share of DRAM bit shipments.

The overall result is that the travails of one segment—like the embattled PC space—won’t be able to disrupt the entire market, lacking the size and critical mass to do so. The server and mobile segments also help by using more specialized products that require a more involved design-in process, thereby reducing the commodity nature of the DRAM that the segments consume.

The Taiwanese are no longer the powerhouse suppliers they used to be, while Qimonda of Germany and Elpida have gone bankrupt.

By the end of this year, only three DRAM manufacturers will remain—Samsung and SK Hynix of South Korea, and US-based Micron Technology. With fewer entities to influence the market, a more conservative approach to capacity expansion is expected, and more stable growth can follow.

A final factor helping the global DRAM business is the slower pace of advancement in DRAM manufacturing processes. Each new generation of DRAM manufacturing technology is now taking longer to arrive resulting in slower bit growth, which is keeping supply in better balance with demand.

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Power Supplies Recom Electronic DC/DC converters can power IGBT drivers

2013/07/02

Recom Electronic DC-DC converters Recom Electronic has introduced a number of DC/DC converters – RH, RV, RP, RGZ, RKZ, RxxPxx, and RxxP2xx – with asymmetric outputs of +15V and -9V making them suitable for powering IGBT drivers.

The modules are available with input voltages of 5VDC, 12VDC, and 24VDC and offer up to 6.4kVDC/1sec isolation.

The converters operate reliably at temperatures between -40°C and +90°C without de-rating and with an efficiency of up to 85%.

To meet the requirements of the different IGBT applications, RECOM offers various pin-outs and packages (SIP/DIP). Products are also available with short circuit protection.

The converters are EN60950-1 certified.

For more information, see http://www.recom-electronic.com

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Manufacturing CEA-Leti extends 193nm litho

2013/07/10

leti CEA-Leti says that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

Leti and Arkema launched the IDEAL program in 2011 to develop lithography techniques based on nanostructured polymers, using 300mm directed self-assembly (DSA) process and material solutions for 1X nodes. The partners, which include Sokudo, Tokyo Electron, STMicroelectronics and advanced academic laboratories, such as LTM and LCPO, have demonstrated DSA resolution capability down to sub-10nm half-pitch.

“IDEAL is addressing the limits of conventional optical lithography with a technological solution that offers potential cost-reduction opportunities,” said Serge Tedesco, Leti’s lithography program manager. Self-assembly lithography with block copolymer is a highly promising complementary technology due to its low manufacturing costs and its straightforward integration in existing device-manufacturing processes.”

The collaboration also recently completed DSA process integration in Leti’s 300mm pilot line and new specific modules have been implemented in the 300mm Sokudo DUO Track for coating, baking and PMMA removal, one of the key steps in DSA process implementation.

IMAGINE, a multiple electron-beam-lithography R&D program with a dozen partners, is focused on developing maskless lithography (ML2) based on MAPPER Lithography tools for high throughput.

The IMAGINE program this year will interface a 1,300-electron-beam tool (Matrix platform) with the Sokudo 300mm DUO Track, targeting a throughput of one wafer per hour. That will be followed by a 13,000-beam system producing a throughput of 10 wafers per hour in early 2015. The longer-term goal is a cluster of 10 modules allowing a throughput of 100 wph to support 1Xnm logic-nodes production.

Launched as a three-year project in 2009, IMAGINE was extended for four years in 2012. Besides Leti and MAPPER, the program also includes TSMC, STMicroelectronics, Nissan Chemical, TOK, Dow, JSR Micro, Sokudo, TEL, Mentor Graphics and Aselta Nanographics.

“These concrete results clearly show the industry that DSA and ML2 can extend 193nm immersion lithography by providing cost-effective solutions for critical-layer patterning,” Tedesco said. “They also demonstrate the value of combining the broad and deep technological strengths of Leti, MAPPER, Arkema, and all our partners in programs focused on meeting the demands at 1X nodes.”

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